|
深圳稻田电子材料有限公司 
| 联系人：王爱生 先生 (销售经理) |
 |
| 电 话：13530990765 |
|
| 手 机：13530990765 |
|
 |
|
 |
|
 |
|
| 供应大功率CT285银胶 |
单组份，导热系数25W/mK，适合3-5W大功率LED和模组。自动点胶机适用。
Introduction
Die Attach Paste ”KEMITITE CT285” is epoxy resin based and solvent free Type paste.
The highest thermal conductivity (25W/mK)
Good reflow performance due lower moisture absorption resin system.
CT285 is effectively used for power IC, transistor.
Features
1） Good workability for dispensing due to solvent free and one liquid type paste.
2） Highest thermal conductivity(25W/mK)
3） Bleed less.
General Property
Properties Unit Typical Value Test Method
Appearance – Silver Filled Paste Visual
Viscosity at 25C Pa·s 100 EHD Viscometer 0.5rpm
(3°cone)
Thixotropic Index – 6.0 0.5rpm/2.5rpm
Non Voletile Wt% 92.0 180C×2hr
Silver Content Wt% 87.5 600C×3hr
Adhesive Strength 25C
300C N 30
20 Frame: Cu/PPF
Chip Size: 2×2mm
Volume Resistivity Ohm.cm 8×10-6 Cure: 200C×90min
Measurement: Room Temp
Glass Transition Temperature C 200 TMA
Modulus(25C) 25C GPa 16.5 DMA
260C 7.8
CTE Alpha 1 Ppm 75 TMA
Alpha 2 200
Ionic Impurity Na ppm 6
1 Atomic Absorption
Ionchromatography
CI
Thermal Conductivity W/m K 25 Laser Flash
4. Standard Cure Condition
175C×60-90min
5. Remarks
Storage condition is _30 to _15C 6 month
CAUTION: Property values listed are typical values. The data herein is for information only. |
 |
| |
|
|
 |
|
|
免责声明： 以上所展示的信息由会员自行提供，内容的真实性、准确性和合法性由发布会员负责，企业录对此不承担任何责任。如有侵犯您的权益，请来信通知删除。